Amkor Technology, Inc.

Good day, ladies and gentlemen, and welcome to the Amcor Technology Third Quarter 2026 Earnings Conference Call. My name is Diego, and I will be your conference facilitator today. At this time, all participants are in a listen-only mode. After the speaker's remarks, we will conduct a question-and-answer session. As a reminder, this conference is being recorded. I would now like to turn the call over to Jennifer Jue, Head of Investor Relations. Ms. Jue, please go ahead.

Good afternoon and welcome to AMCOR's third quarter 2026 earnings conference call. Joining me today are CEO Kevin Engel and CFO Megan Faust. Our earnings press release was filed with the SEC this afternoon and is available on the investor relations page of our website, along with the presentation slides that accompany today's call. During this presentation, we will use non-GAAP financial measures and you can find reconciliation to the comparable gap financial measures in the slides. We will make forward-looking statements today based on our current beliefs, assumptions and expectations. Please refer to our press release for a disclaimer on forward-looking statements and our SEC filings for a discussion on the risk factors and uncertainties that may affect our future results. I will now turn the call over to Kevin.

Thank you, Jennifer. Good afternoon, everyone, and thanks for joining. AMCOR delivered a strong third quarter with revenue of approximately $2 billion. For the second consecutive quarter, we achieved record revenue in both computing and automotive and industrial end markets. Gross margins expanded to over 18%, and operating margins increased to over 11%. These results reflect continued execution against our strategy and demonstrate the improving earnings power of our business. On a year-on-year basis, revenue in the third quarter continued to accelerate in computing and automotive and industrial with both end markets growing 37%. In computing, demand remained robust and our flagship HDFO, CPU program ramped throughout the quarter. Automotive and industrial continue to benefit from strong demand for advanced in-car computing applications such as ADAS and infotainment. Now let me share an update on our three strategic pillars. First, enhancing strategic partnerships in key markets. Customers are engaging earlier aligning technology roadmaps, and making longer-term commitments as advanced packaging becomes increasingly critical to AI and high-performance computing. We continue to see a shift in how customers support capacity expansions. Customers are not only planning further ahead, but are also making long-term commitments and providing advanced payments tied to future capacity requirements. This gives us confidence as we accelerate our capital spending above historical norms. We believe this reflects a broader change in our industry. These commitments reflect our customers' confidence in their long-term, advanced packaging requirements and in Amcor's ability to support their product roadmaps. For Amcor, these agreements improve visibility, strengthen alignment with our customers, and support disciplined investment in advanced packaging capacity as our global footprint increases, including Arizona and our Asia facilities. The second pillar is elevating technology leadership. Customer engagements remain strong across our advanced packaging platforms and our pipeline continues to broaden. The progress we are making across our HDFO and 2.5D programs continues to reinforce positive outlook for the long-term growth opportunities in computing. Our flagship HDFO CPU program is scaling. An additional HDFO CPU program for a hyperscaler began ramping in Q3. And two new 2.5D programs in networking and data center are expected to come online in Q4. Customer engagement is particularly strong in next-generation AI infrastructure, with additional advanced packaging opportunities developing across traditional data center, PC applications, and automotive. Advanced packaging is on the critical path of system performance. As customers push for greater performance, higher bandwidth, and improved power efficiency, Packaging technology is playing a larger role in enabling product roadmaps. As a result, customer discussions today are broader than they were just a few years ago. We are increasingly engaged in architectural design, technology roadmaps, and test strategy, along with long-term capacity planning. Our turnkey model allows us to integrate advanced packaging and test capabilities providing customers with more complete solutions. This strengthens our competitive position, deepens customer relationships, and creates additional opportunities to deliver value across the product lifecycle. Taken together, the breadth of customer engagements we see today affirms our view that advanced packaging will remain a meaningful growth driver for Amcor over the coming years. Our third pillar is expanding our geographic footprint. In September, we announced phase two of our Arizona Advanced Packaging and Test Campus, which is expected to break ground in late 2027 as phase one construction nears completion. Together, both phases are planned to be over 90,000 square meters of clean room space and represent an estimated investment of $12 billion. When fully ramped, the campus is expected to support a workforce of over 3,500 employees, strengthening the U.S. semiconductor ecosystem, and support our customers' long-term needs. In Korea, we recently broke ground on two new buildings on our Gwangju campus. This additional space is being built to support the continued ramp of HDFO for our data center customers. including the recent announcement with NVIDIA. On our Songdo campus, the new assembly and test building remains on schedule for completion by year end. The incremental space is planned to expand test capacity for automotive and data center customers and strengthen our regional turnkey capabilities. Following completion of these expansions in 2028, Our Korea footprint is expected to increase by 40% from 2025. This cements Korea as a center of excellence for high-value advanced packaging. Our Vietnam build-out is also progressing as planned, with increasing scale and a continued focus on automation. Automation allows for optimal space planning, higher equipment utilization, and quality assurance. Our vision is for Vietnam to become our SIP Center of Excellence. It's been exciting to see this facility ramp from a piece of undeveloped land in 2021 to a high-tech manufacturing operation today. As we migrate SIP from Korea to Vietnam, we are opening up needed cleanroom space in Korea for additional advanced packaging growth. The release space in Korea is being redeployed and quickly consumed by advanced packaging customers. In closing, our third quarter results demonstrate strong execution and continued momentum across the business. We delivered record revenue in computing and automotive and industrial, expanded margins, and advanced key programs. Customer commitments continue to grow. giving us greater visibility as we expand advanced packaging capacity. We are well positioned to capture long-term growth opportunities ahead. I will now turn the call over to Megan to provide more detail on our third quarter performance and near-term outlook.