Amkor Technology, Inc.

Good day, ladies and gentlemen, and welcome to the Amcor Technology First Quarter 2026 Earnings Call. My name is Diego, and I will be your conference facilitator today. At this time, all participants are in a listen-only mode. After the speaker's remarks, we will conduct a question-and-answer session. As a reminder, this conference is being recorded. I would now like to turn the call over to Jennifer Zhu, Head of Investor Relations. Ms. Zhu, please go ahead.

Good afternoon, and welcome to AMCOR's first quarter 2026 earnings conference call. Joining me today are CEO Kevin Engel and CFO Megan Faust. Our earnings press release was filed with the SEC this afternoon and is available on the investor relations page of our website, along with the presentation slides that accompany today's call. During this presentation, we will use non-GAAP financial measures and you can find the reconciliation to the comparable GAAP financial measures in the slides. We will make forward-looking statements today based on our current beliefs, assumptions, and expectations. Please refer to our press release for a disclaimer on forward-looking statements and our SEC filings for a discussion on the risk factors and uncertainties that may affect our future results. I will now turn the call over to Kevin.

Thank you, Jennifer. Good afternoon, everyone. Thank you for joining us today. AMCOR delivered a strong start to the year, achieving record first quarter revenue of $1.68 billion, up 27% year on year. We saw growth across all end markets and were encouraged by the breadth of demand we're seeing across our technology platforms. Communications delivered the strongest growth, and Mainstream posted its fourth consecutive quarter of both sequential and year-on-year growth. Leading chip companies continue to trust us for their advanced packaging and test needs. We are clearly benefiting from our partnerships and our leading technology as we execute on a growing set of advanced packaging programs. Earnings per diluted share were 33 cents, significantly higher than last year, reflecting disciplined execution and continued progress on our margin initiatives. Overall, this was a quarter that reflected momentum and demand, disciplined execution by our teams, and continued preparation for the advanced packaging ramps we expect in the second half of the year. As we discussed last quarter, overall semiconductor demand is robust. The industry backdrop remains dynamic. We are closely monitoring export controls and evaluating trade policies. We see supply dynamics around advanced silicon, advanced substrates, and memory, and are managing these risks with agility alongside our customers and suppliers. Some customer supply materials are being delayed, causing nonlinear loading. This has been expected, and we are prioritizing production where materials are available to minimize impact. Uncertainty related to the geopolitical events in the Middle East have increased over the last few months. To date, we have not seen any supply disruptions related to these dynamics. However, Conditions in the region are putting additional pressure on material pricing. We're working closely with our customers to offset these increases across the supply chain. Now let me share an update on our strategic initiatives. First, elevating technology leadership. We continue to invest in advanced packaging platforms, including HDFO, flip chip, and test. These are critical to next generation AI in high performance computing. As discussed last quarter, we are engaged on several HDFO programs this year, and the newest data center CPU program is expected to begin ramping this quarter. Our preparations in Korea remain on track to scale this program into high volume the second half of the year. Overall, we see increasing opportunities for the compute market from a diverse customer base. Second, expanding our geographic footprint. In 2026, our priorities include meeting construction milestones of our Arizona facility and expanding manufacturing space in Korea. In Arizona, we are excited to see the progress as we wrap up foundation work and move towards building steel construction. Construction of phase one is planned to be completed in 2027. In Korea, the new test building is on track for completion at the end of this year. This will provide incremental space to support data center demand going into 2027. Third, enhancing our strategic partnerships in key markets. We continue to strengthen collaboration with customers across the ecosystem, including foundries, fabulous companies, IDMs, and OEMs. As part of our partnership engagement model, our customers are making contributions that help align technology roadmaps, support our capital investment, and enable rapid ramps as new capacity comes online. Across all three pillars, we remain focused on margin improvements driven by operational excellence, increased utilization, favorable pricing, and a sustained mix shift towards higher value advanced packaging. Our mainstream factories in the Philippines are seeing improving demand, and we're continuing to optimize cost in Japan. Utilization of our advanced sites in Korea and Taiwan is increasing, improving profitability. In just over three weeks, we will host our 2026 Investor Day. This will give us an opportunity to provide deeper view into our strategic pillars. We will explain Amcor's position as the semiconductor industry turns to advanced packaging for value creation. We are well positioned for this shift, and we are at the beginning of a multi-year value creation journey. We're excited about our future. We look forward to sharing more of our story at the event on May 21st. I'll now turn the call over to Megan to provide more details on our first quarter performance in near-term outlook.