SCHMID Group N.V.

Ladies and gentlemen, we warmly welcome you to the 2025 Resolves Conference call and webcast of the Schmid Group. I am pleased to welcome the CFO, Arthur Schütz, and CSO, Roland Rettenmaier, who will guide us through the presentation shortly, after which we will move on to the Q&A session. Before we begin, I'd like to remind everyone that today's discussion will contain forward-looking statements within the meaning of applicable securities laws. These statements are based on current expectations and assumptions and are subject to risks and uncertainties that could cause actual results to differ materially from those described in these forward-looking statements. Please refer to our filings with the U.S. Securities and Exchange Commission, including our annual report on Form 20-F, for a discussion of these risks and uncertainties. We undertake no obligation to update any forward-looking statements except as required by law. In addition, today's discussion may include certain non-GAAP financial measures. Reconciliations to the most directly comparable GAAP measures can be found in our earnings materials and filings. And with that, I am handing over to you, Arthur.

Thank you. Before we begin, a pretty personal note. I joined Schmidt in January because I believe this company combines great technology, strong market positioning and significant value creation potential. I also invested personally because I believe management and shareholders should be aligned. 2025 was the year of transitioning and repositioning of Schmidt. We saw a significant recovery of our operations during the second half. And over the last six months, we achieved some very important milestones. We secured solid financing for the group through our $30 million convertible announced in January. And we just announced a $30 million standby equity line, which allows us to secure funding if and when such funding is required. We reduced our debt through various debt-to-equity programs. This call marks our first formal investor call, and we intend to engage with the market on a more regular and transparent basis going forward. We also plan to provide quarterly trading updates on revenue and order intake. Over recent months, we have intensified our focus on margins and cost discipline, in particular our central costs for German overhead, as well as listing related costs. I will talk more about that during this presentation. Lastly, we are also strengthening our ownership culture and changing compensation of management and board to obtain more share-based compensation and align everybody more with the interests of our shareholders. That sets the strategic contest. Let me now hand over to Roland, who will walk you through the technology drivers and why we believe our growth outlook is compelling.

Thank you, Arthur. I will give you all a short business update of Schmid. Schmid is a trusted equipment provider for the electronics industry for more than 60 years, and we've continuously upgraded our platforms, the Infinity Line H+, and the Infinity Line V+. While we continued the evolution of those product lines, we started investing and developing the next generation equipment like the C+, the L+, and the P+. In addition to this, this L plus panel sized CMP equipment and the Infinity Line P plus, our next generation panel level packaging equipment were developed and well adapted by the market. This is leading to an above market growth for Schmid. We also recognize a shift from wafer to panel level packaging. High performance computing and AI are driving the industry towards larger compute package sizes like 120 by 120 millimeter. These bigger packages are increasingly being manufactured on rectangular substrates on panel. as producing them on wafer would mean wasting a lot of production area and material. We currently recognize that several panel sizes, mostly 310x310, 510x515 and 600x600 mm are being established by our customers TSMC, Intel and Samsung, as well as by their supply chain. As Schmidt is providing panel-level packaging equipment or panel-level production equipment to the industry, this plays very much into our core competence. And we expect that this panel-level packaging market will grow three to four fold by 2030. The enormous computing demand of AI and high-performance computing drives the industry towards larger and larger packages. For example, see NVIDIA and AMD who introduced new product families about every 18 months with compute units of increasing body size, as you see it on this picture. This is emphasizing advanced packaging on panel level. We also see the demand for novel device architectures. This high performance computing and AI computing are calling for denser structures on the wiring, power consumption, thermal management of the packages, chip and wafer on PCB and other developing components. other developments are driving more complexity into advanced packaging, such as layer counts, modified SAP and SAP structures combining in substrate-like PCBs. Schmid optimized the equipment for these processes over decades and through different technological development cycles. Thus, Schmid equipment is recognized as the most stable and best quality and highest yield equipment. As the cost for scrap material is significant, especially when you increase the body size of the package, the production yield our equipment is providing becomes paramount. Our new products are adopted well by the market. As earlier mentioned, the new product families, Infinity Line C+, L+, and P+, are well received by the market. While our workhorses H+, and V+, are growing well with the electronics market, which is growing at about 10% year-over-year, it is these three products which will drive a buff market growth for Schmidt. We believe we are approaching the commercial inflection point where these products transition into meaningful revenue contributors for Schmidt. The momentum of AI infrastructure and optical modules, as well as the adoption of the new product families, are the reasons for Schmid growing stronger than the market. As shown here, we recognize great adoption and significant order intake for these new products starting in 2023, which was continuously increasing. Based on current customer activity, we expect continued commercial momentum and potential addition order announcement for the next few products within the next few months. Q1 2026 showed a very strong market in China and we expect in general a very strong second half of 2026 for Schmidt through continuing AI server port demands and huge expansions in the area of flipchip BGA substrates. With this, I'm handing over to Arthur.