Valens Semiconductor Ltd.

Good morning. My name is Yoni, and I will be your conference operator today. At this time, I would like to welcome everyone to Valencia Semiconductor's first quarter 2024 earnings conference call and webcast. All participant lines have been placed in a listen-only mode. Opening remarks by Valencia Semiconductor management will be followed by a question and answer session. I will now turn the call over to Lisa Fortuna, investor relations, for Valens Semiconductor. Please go ahead.

Thank you and welcome everyone to Valens Semiconductor's first quarter 2024 earnings call. With me today are Gideon Benzie, Chief Executive Officer, and Guy Mathenzen, Chief Financial Officer. Earlier today, we issued a press release that is available on the investor relations section of our website under investors.valens.com. As a reminder, today's earnings call may include forward-looking statements and projections. which do not guarantee future events or performance. These statements are subject to the safe harbor language in today's press release. Please refer to our annual report on form 20F filed with the SEC on February 28th, 2024 for a discussion of the factors that could cause actual results to differ materially from those expressed or implied. We do not undertake any duty to revise or update such statements to reflect new information, subsequent events or changes in strategy. We will be discussing certain non-GET measures on this call, which we believe are relevant in assessing the financial performance of the business, and you can find reconciliations of these metrics within our earnings release. In the coming weeks, we will be attending the Oppenheimer 9th Annual Emerging Growth Conference and the Oppenheimer 25th Annual Israeli Conference in Tel Aviv, Israel. If you are interested in meeting with us, please email us at investors at valenz.com. With that, I'll now turn the call over to Gideon.

Hello, everyone, and thank you for joining Valen Semiconductor's first quarter 2024 earning call. On our last call, we discussed the macroeconomic headwinds that would impact our business in 2024 and the first quarter operating environment was in line with our expectations. While we were pleased to report some upsets relative to our previously reported guidance, we continued to be impacted by ongoing slow inventory digestion in the audio-video market and in the automotive segment. Additionally, persistently high interest rates fueled by creeping inflation continued to impact our business landscape. Despite this environment, Valen Semiconductor remains determined to expanding our collaborations and partnerships across the diverse verticals we serve and we made good progress in this regard during this quarter. Later in the call Guy will dive into the details, but for now I want to cover Valence first quarter's performance at a high level. We are pleased to report that our revenue exceeded the top end of our guidance at $11.6 million. GAAP gross margin for the first quarter came in at 59% and adjusted EBITDA loss was $7.1 million, better than our guided range. Valen Semiconductor's robust balance sheet with $139.8 million of cash and cash equivalents allows us to continue investing in innovations and pursue long-term growth opportunities. We are looking to weather these headwinds. Now, let me turn to our performance and the trends we are seeing in the markets we serve. Starting with audio-video. As we discussed last quarter, our ongoing investment in expanding our presence within multiple verticals of our audio-video market enables us to capitalize on positive long-term trends thanks to the opportunities presented by the latest product additions to our portfolio. in particular the VA6320 and the VA7000 chipsets. We estimate that these verticals, which include video conferencing, industrial and machine vision, could represent a total addressable market of approximately $1 billion per annum. We are currently in the process of outlining this opportunity in a modified strategic multi-year plan, which we expect to communicate to the market in the coming months. Within the video conferencing vertical, a recent Frost and Sullivan report states that over $3 billion global video conferencing device market targeted by our customer is undergoing fundamental shifts. Despite current market conditions, video communication is becoming essential to the new office and conference room settings, creating greater market adoption. To this point, the CEO of Logitech, one of our customers, recently stated that the time in video conferencing is enormous. He also said, if you look out 10 years, it makes perfect sense that all conference rooms will be video enabled. We obviously agree with this market leader assessment. This is consistent. with what we have heard from additional customers who say the key growth drivers of this market are hybrid work and modernization of meeting rooms. There is growing demand for multi-camera rooms with higher attached rates of accessories and rapid innovations of AI in camera technology that enhances the meeting experience. Of course, many of these ProAV devices require high performance extension Valen solutions are ideal for delivering a seamless plug-and-play user experience for hybrid environments and multi-camera rooms. As the global video conferencing device market continues to grow, so will the need for our robust connectivity solutions. An example of how we plan on capturing the value of the increasing global video conferencing market is our VS6320. a first-of-its-kind USB 3.2 high-performance extension solution. The VS6320 is a game changer in the market, solving connectivity problems that exist for current technologies with a combination of multi-gig bandwidth and long-range USB extension, enabling new use cases. We are very proud and have great expectations from this new, welcomed member TowerChip family. We introduced the VS6320 in Q4 2023 and since then it was already designed into over 30 products and the interest from additional customers continues to build for this chipset. We anticipate multiple announcements and product launches as early as the Infocom International Trade Show this June. We are excited to see the initial backlog and expect sales to further ramp up during the second half of 2024. The VS6S320 also has applications above and beyond video conferencing, and we expect to see the chipset to begin powering innovation in multiple markets. Moving on, as you are all no doubt aware, there is a rise in the use of AI across industries. For many applications, especially those requiring high resolution, real time video and data aggregated from multiple cameras, a high performance connectivity solution is often required. Valence connectivity solutions have the potential to play a pivotal role in facilitating the adoption of artificial intelligence across multiple industries. An example of this is our collaboration with Taiwan-based AI image processing company iCatch Technology, which aims to introduce a multi-camera solution based on their SoC and Valence VA7000 chipset for the video conferencing and machine vision markets. With our VA7000 chipsets, we enable a robust, high-bandwidth, zero-latency connectivity infrastructure, enabling real-time video processing and decision-making that is required for enhanced AI applications today. iCache also plans to launch an AI-enhanced multi-channel surround-view monitoring system for the automotive industry using our A5-based BA7000, which further underscores the versatility and impact of our high-performance technology across different sectors. Moving to automotive. Overall, our automotive business is stable. As you know, our first-generation VA6000 chipsets are using Mercedes-Benz infotainment and telematic systems. 2023 was our first full year of selling into a broad range of Mercedes-Benz models, including their EV models. Between the fourth quarter of 2023 and the first quarter of 2024, we saw a reduction in revenues in our automotive business due to inventory digestions. With our asymmetric VA7000 MIPI AFI-based chipset, we continue to make encouraging progress in various evaluation processes. Last month, we announced a significant milestone in our collaboration with Sony Semiconductor Solutions Corporation as we jointly completed EMC and interoperability testing of a multi-vendor AFI link. Ideally, This will lead to a mature Sony A5 integrated image sensor that is compatible with our BA7000 deserializer chip. In addition to deepening the collaboration between Valence and Sony, one of the top three automotive sensor suppliers in the world, we are announced that we are developing an 8-megapixel A5 camera module of Ada system that will be prepared in the coming months. Earlier this year, we continued to see the strong interest in our innovative technology from the automotive market. During the quarter, we invested in following up on new and interesting opportunities which resulted from our demonstrations at the show. Nowhere was this more apparent than in our EMC shootout where our VA7000 A5 chipset outperformed competing proprietary extension solutions. Our chipset was able to withstand around 20 times more noise than competition. As the industry is evolving and the OEMs are pushing to integrate more sensors at higher resolutions with increased bandwidth requirements, the fragility of the links require high performance connectivity. Keeping a resilient link between a camera and an SOC is crucial for guaranteeing ADAS performance and passenger safety. This MIPI AFI ecosystem will further strengthen this quota by our partnership with Black Sesame Technologies to enable the integration of AFI connectivity into their autonomous driving platform and later into their cross-domain computing platform. Leveraging the VA7000 chipset, Black Sesame Technologies will offer and support the AFI connectivity standards for its automotive OEM and tier 1 customers. Black Sesame Technology is a leading automotive-grade computing SOC and SOC-based intelligent vehicle solution provider. According to the co-founder and president, Black Sesame decided to move forward with these implementations because of the significant interest they see for MIPI-API connectivity both within China and around the globe. Of course, we also continue to work closely with Intel Foundry Services on developing the next generation of our A5 compliant chipsets for the automotive sector. We announced our strategic collaboration with IFS earlier in the first quarter and are proud to be partnering with one of the most important innovators in the industry. During the first quarter, we also announced our latest chipset innovation, the VA700R, engineered to address critical visibility challenges faced by truckers on highways. This groundbreaking solution offers a combination of bandwidth and link distances, enhancing both surround view and rear view visibility. Our VA700R chipsets can serve as the fundamental connectivity infrastructure, empowering automotive OEMs and tier one suppliers to forge future innovations. The VA700R sets the stage for a new era of advancement in the trucking industry to assist drivers in navigating challenging conditions including significantly compromised visibility. With the robust capabilities of our chipsets, tracking safety and operational efficiency tends to be significantly enhanced. We believe that our technological innovation combined with our ability to identify opportunities within the industry could position us to take advantage of the total addressable market in this particular automotive segment it could reach about $4.5 billion per annum by 2029. While the automotive market continues to suffer from slower decision-making process, in light of the macroeconomic environment, we remain confident in the ability of our technology to play a leading role in the in-vehicle connectivity solution markets.